Sistimi ea motlakase e meraro, e leng betri ea matla, selaoli sa enjene le koloi, ke karolo ea mantlha e khethollang tšebetso ea lipapali tsa makoloi a macha a matla. Karolo ea mantlha ea karolo ea koloi ke IGBT (Insulated Gate Bipolar Transistor). E le "CPU" indastering ea lisebelisoa tsa elektronike, IGBT e tsejoa lefatšeng ka bophara e le sehlahisoa se emelang ka ho fetisisa phetohong ea elektroniki. Li-chips tse ngata tsa IGBT li kopantsoe le ho kopanngoa hammoho ho theha mojule oa IGBT, o nang le matla a maholo le matla a matla a ho felisa mocheso. E bapala karolo ea bohlokoa haholo le tšusumetso tšimong ea likoloi tse ncha tsa matla.
Carman Haas e ka fana ka tharollo ea sebaka se le seng bakeng sa welding ea module ea IGBT. Sistimi ea welding e na le fiber laser, hlooho ea welding ea scanner, molaoli oa laser, khabinete ea taolo, yuniti ea pholiso ea metsi le li-module tse ling tse thusang. Laser e kenya letsoho hloohong ea welding ka phetiso ea fiber ea optical, ebe e khabisoa holim'a thepa e lokelang ho kolobisoa. Hlahisa mocheso o phahameng haholo oa welding ho fihlela ts'ebetso ea welding ea li-electrode tsa taolo ea IGBT. Lisebelisoa tse ka sehloohong tsa ho sebetsa ke koporo, koporo e entsoeng ka silevera, alloy ea aluminium kapa tšepe e sa hloekang, e nang le botenya ba 0.5-2.0mm.
1, Ka ho fetola optical tsela karo-karolelano le tshebetso parameters, tšesaane koporo mekoallo ka tjheseletsa ntle spatter (ka holimo koporo lakane <1mm);
2, E na le module ea ho shebella matla ho lekola botsitso ba laser ka nako ea nnete;
3, E na le sistimi ea LWM/WDD ho lekola boleng ba weld ea seam e 'ngoe le e' ngoe ea marang-rang ho qoba liphoso tse bakoang ke liphoso;
4, ho kenella ka tjheseletsa ho tsitsitse ebile ho phahame, le ho feto-fetoha ha ho kenella ho <± 0.1mm;
Tšebeliso ea li-welding tsa koporo tse teteaneng tsa IGBT (2+4mm / 3+3mm).